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SICAMORE SEMICONDUCTOR, INC.
BEND, OR, 97702
Unclaimed
Subcontracting experience
2 records from government sources. Past participation is not evidence of current teaming interest.
| Role | Agency | Description | Vehicle | Obligated | Action date | Period |
|---|---|---|---|---|---|---|
| Subcontractor | Department of Defense | SIC JFET - 1 LAYER METAL, INSULATING (1ST LOT - 6 WAFERS) 1172496 Parent award context Parent award agency: Department of Defense · Defense Microelectronics Activity Parent award NAICS: 541330 Parent award performance state: NH Parent award description: THE PURPOSE OF THIS EFFORT IS ANALYZE, DESIGN, FABRICATE AND TEST A HIGH TEMPERATURE SIC DEVICE. View parent award on USAspending | HQ072716D0002USAspending | $369,024 | Jan 23, 2023 | — – — |
| Subcontractor | Department of Defense | SIC MOSFET - 2 LAYER METAL - PROCESS FLOW PLAN & SCHEDULE 6 WAFERS 1128999 Parent award context Parent award agency: Department of Defense · Defense Microelectronics Activity Parent award NAICS: 541330 Parent award performance state: NH Parent award description: THE PURPOSE OF THIS EFFORT IS ANALYZE, DESIGN, FABRICATE AND TEST A HIGH TEMPERATURE SIC DEVICE. View parent award on USAspending | HQ072716D0002USAspending | $97,175 | Oct 19, 2021 | — – — |
Contract vehicles are shown only when present in the source record. Linked award numbers and vehicles open the authoritative record on USAspending.gov.