APPLIED MICROENGINEERING LIMITED
DIDCOT, OX110
Prime contracting experience
1 record from government sources. Past participation is not evidence of current teaming interest.
| Role | Agency | Description | Vehicle | Obligated | Action date | Period |
|---|---|---|---|---|---|---|
| Prime | Department of Defense Department of the Navy | PURCHASE ORDER | — | $985,539 | Jun 29, 2026 | Oct 9, 2024 – Oct 10, 2025 |
Contract vehicles are shown only when present in the source record. Linked award numbers and vehicles open the authoritative record on USAspending.gov.
Subcontracting experience
1 record from government sources. Past participation is not evidence of current teaming interest.
| Role | Agency | Description | Vehicle | Obligated | Action date | Period |
|---|---|---|---|---|---|---|
| Subcontractor | Department of Defense | DESIGN AND MANUFACTURE OF WAFER BONDING SYSTEMS, WITH INTEGRATED WAFER-TO-WAFER ALIGNMENT CAPABILITY P162996 Parent award context Parent award agency: Department of Defense · Department of the Air Force Parent award NAICS: 541715 Parent award performance state: VA Parent award description: MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) View parent award on USAspending | FA807518D0004USAspending | $542,878 | Feb 6, 2024 | — – — |
Contract vehicles are shown only when present in the source record. Linked award numbers and vehicles open the authoritative record on USAspending.gov.
Agencies supported
- Department of DefenseGov-sourced
Government-sourced data comes from SAM.gov, SBA and USAspending.gov and is attributed to its source. Items marked company-reported were provided by the company and are verified by FedSub only where labeled. FedSub is a private company and is not affiliated with SBA, GSA/SAM.gov, or any government agency.