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IRVINE SENSORS CORPORATION
COSTA MESA, CA, 92626
UnclaimedClaim this profile (free)
Prime contracting experience
4 records from government sources. Past participation is not evidence of current teaming interest.
| Role | Agency | Description | Vehicle | Obligated | Action date | Period |
|---|---|---|---|---|---|---|
| Prime | Department of Defense Defense Contract Management Agency | IRVINE SENSORS CORPORATION SBIR PHASE II | — | $987,424 | Aug 12, 2025 | Jan 30, 2019 – Dec 4, 2023 |
| Prime | Department of Defense Defense Contract Management Agency | THIS IS A RIF BAA HQ0034-17-BAA-RIF-0001 FOR THE DEVELOPMENT OF ENHANCED ALERT SYSTEM. THIS CONTRACT IS FFP 12 MONTH EFFORT TO SUPPORT HAVE VIDEO ANALYTICS PERFORMED IN REAL TIME ON LIVE SECURITY STREAMS OR IN THE BACKGROUND ON RECORDED STREAMS, VISUALIZE BOUNDING BOXES AROUND DETECTED PERSONS | — | $899,782 | Aug 15, 2022 | Sep 18, 2018 – Dec 22, 2019 |
| Prime | National Aeronautics and Space Administration National Aeronautics and Space Administration | IGF::OT::IGF THE COMPUTING CAPABILITIES OF ONBOARD SPACECRAFT ARE A MAJOR LIMITING FACTOR FOR ACCOMPLISHING MANY CLASSES OF FUTURE MISSIONS. ALTHOUGH TECHNOLOGY DEVELOPMENT EFFORTS ARE UNDERWAY THAT WILL PROVIDE IMPROVEMENTS TO SPACECRAFT CPUS, THEY DO NOT ADDRESS THE LIMITATIONS OF CURRENT ONBOARD MEMORY SYSTEMS. IN ADDITION TO CPU UPGRADES, EFFECTIVE EXECUTION OF DATA-INTENSIVE OPERATIONS SUCH AS TERRAIN RELATIVE NAVIGATION, HAZARD DETECTION AND AVOIDANCE, AUTONOMOUS PLANNING AND SCHEDULING, AND ONBOARD SCIENCE DATA PROCESSING AND ANALYSIS REQUIRE HIGH-BANDWIDTH, LOW-LATENCY MEMORY SYSTEMS TO MAXIMIZE PROCESSOR USAGE (THE ?MEMORY WALL?) AND PROVIDE RAPID ACCESS TO OBSERVATIONAL DATA CAPTURED BY HIGH-DATA-RATE INSTRUMENTS (E.G., HYPERSPECTRAL INFRARED IMAGER, INTERFEROMETRIC SYNTHETIC APERTURE RADAR). 3D ICS, AFTER A LONG WAIT, IS NOW A REALITY. THE FIRST MAINSTREAM PRODUCT IS 3D MEMORY CUBES, WHERE MULTIPLE MEMORY TIERS (4 DRAM TIERS AS OF 2015) ARE VERTICALLY INTEGRATED TO OFFER MANIFOLD IMPROVEMENT IN SIZE, CAPACITY, SPEED, AND POWER CONSUMPTION COMPARED WITH 2D COUNTERPARTS. INDEED, THESE ARE THE MEMORY PARTS THAT WILL TRULY ENABLE AFOREMENTIONED MISSIONS. UNFORTUNATELY, NONE OF THESE ARE READY FOR SPACE. THE PURPOSE OF THIS RESEARCH IS TO INVESTIGATE THE CHALLENGES AND OPPORTUNITIES IN DEPLOYING 3D MEMORY CUBES INTO SPACE MISSIONS. | — | $708,959 | Jun 3, 2022 | Jun 7, 2017 – Dec 31, 2021 |
| Prime | National Aeronautics and Space Administration National Aeronautics and Space Administration | THE COMPUTING CAPABILITIES OF ONBOARD SPACECRAFT ARE A MAJOR LIMITING FACTOR FOR ACCOMPLISHING MANY CLASSES OF FUTURE MISSIONS. ALTHOUGH TECHNOLOGY DEVELOPMENT EFFORTS ARE UNDERWAY THAT WILL PROVIDE IMPROVEMENTS TO SPACECRAFT CPUS, THEY DO NOT ADDRESS THE LIMITATIONS OF CURRENT ONBOARD MEMORY SYSTEMS. IN ADDITION TO CPU UPGRADES, EFFECTIVE EXECUTION OF DATA-INTENSIVE OPERATIONS SUCH AS TERRAIN RELATIVE NAVIGATION, HAZARD DETECTION AND AVOIDANCE, AUTONOMOUS PLANNING AND SCHEDULING, AND ONBOARD SCIENCE DATA PROCESSING AND ANALYSIS REQUIRE HIGH-BANDWIDTH, HIGH-CAPACITY MEMORY SYSTEMS TO MAXIMIZE DATA STORAGE AND PROVIDE RAPID ACCESS TO OBSERVATIONAL DATA CAPTURED BY HIGH-DATA-RATE INSTRUMENTS (E.G., HYPERSPECTRAL INFRARED IMAGER, INTERFEROMETRIC SYNTHETIC APERTURE RADAR). THREE-DIMENSIONAL ICS, AFTER A LONG WAIT, ARE NOW A REALITY. THE FIRST MAINSTREAM PRODUCTS ARE 3D MEMORY CUBES THAT OFFER MANIFOLD IMPROVEMENTS IN SIZE, CAPACITY, SPEED, AND POWER. UNFORTUNATELY, NONE OF THESE ARE READY FOR SPACE. THE PURPOSE OF THIS RESEARCH AND DEVELOPMENT IS TO PURSUE A NON-VOLATILE, 3D MEMORY MODULE THAT CAN MEET THE HIGH-RELIABILITY REQUIREMENTS OF SPACE AND INTERFACE TO THE HIGH PERFORMANCE SPACE COMPUTER (HPSC) USING A HIGH-SPEED SERIAL INTERFACE. DEVELOPMENT WILL INCLUDE FABRICATING A 3D MEMORY CUBE AND RTL FOR A FPGA BASED MEMORY CONTROLLER WHICH WILL EVENTUALLY BE MIGRATED TO A RAD-HARD ASIC. THE FPGA BASED PLATFORM WILL INTEGRATE A 3D MEMORY CUBE TO PRODUCE A 3D MEMORY MODULE PROTOTYPE THAT WILL VALIDATE AND DEMONSTRATE THE FEATURES, RELIABILITY, AND PERFORMANCE OF THE ENVISIONED 3D MODULE. | — | $724,052 | Jan 19, 2022 | Jun 13, 2018 – Dec 31, 2021 |
Contract vehicles are shown only when present in the source record. Linked award numbers and vehicles open the authoritative record on USAspending.gov.
Agencies supported
- Department of DefenseGov-sourced
- National Aeronautics and Space AdministrationGov-sourced
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