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NHANCED SEMICONDUCTORS, INC.
BATAVIA, IL, 60510
UnclaimedClaim this profile (free)
Small Business
Subcontracting experience
22 records from government sources. Past participation is not evidence of current teaming interest.
| Role | Agency | Description | Vehicle | Obligated | Action date | Period |
|---|---|---|---|---|---|---|
| Subcontractor | National Aeronautics and Space Administration | TO PERFORM OXIDE-OXIDE BONDING OF WAFERS AND BACKTHINNING OF THE DEVICES TO A
SPECIFIED THICKNESS. S738351 Parent award context Parent award agency: National Aeronautics and Space Administration · National Aeronautics and Space Administration Parent award NAICS: 541715 Parent award performance state: CA Parent award description: THE ULTRAVIOLET EXPLORER (UVEX) View parent award on USAspending | — | $245,500 | Sep 11, 2026 | — – — |
| Subcontractor | Department of Defense | HYBRID,ASIC&MCM MATL. 4203250917 Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: MA Parent award description: HI2PERF View parent award on USAspending | — | $383,690 | Feb 26, 2026 | — – — |
| Subcontractor | National Aeronautics and Space Administration | SEMICONDUCTOR ADVANCED PACKAGING S714045 Parent award context Parent award agency: National Aeronautics and Space Administration · National Aeronautics and Space Administration Parent award NAICS: 541715 Parent award performance state: CA Parent award description: THE ULTRAVIOLET EXPLORER (UVEX) View parent award on USAspending | — | $66,000 | Feb 2, 2026 | — – — |
| Subcontractor | Department of Defense | WAFER FABRICATION HRL253288 Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: HRL LARGE-FORMAT, SMALL-PITCH FPA FABRICATION FOR MUST-HITS View parent award on USAspending | — | $148,500 | Jul 18, 2025 | — – — |
| Subcontractor | Department of Defense | DEVELOP AND EXECUTE PROCESSES FOR THE ALIGNMENT AND BONDING OF PHOTONIC INTEGRATED
CIRCUIT CHIPS TO SUPPORT THE GOALS OF HAPPI IN INTEGRATING TWO DISCRETE PIC CHIPS WITH OPTICAL
INTERCONNECTS BETWEEN THEM. PAM-P25-001864-SA02 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: NC Parent award description: THE HETEROGENOUS ADAPTIVELY PRODUCED PHOTONIC INTERFACES (HAPPI) PROGRAM AIMS TO CREATE A 1000X INCREASE IN THE INFORMATION TRANSMISSION DENSITY WITHIN A MICROSYSTEM BY EXPLOITING PHOTONIC SIGNALING. View parent award on USAspending | — | $381,657 | May 14, 2025 | — – — |
| Subcontractor | Department of Defense | HUMAN RESOURCES SERV 5300002229 CN11 Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: RESEARCH IAWN DARPA-BAA- HR001119S0078 FOCAL ARRAYS FOR CURVED INFRARED IMAGERS (FOCII) PROGRAM. View parent award on USAspending | — | $31,690 | Mar 17, 2025 | — – — |
| Subcontractor | Department of Defense | DEVELOP AND EXECUTE PROCESSES FOR THE ALIGNMENT
AND BONDING OF PHOTONIC INTEGRATED CIRCUIT CHIPS TO SUPPORT THE GOALS OF HAPPI IN INTEGRATING FOUR
DISCRETE PIC CHIPS WITH OPTICAL INTERCONNECTS BETWEEN THEM. PO106136 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: CA Parent award description: THE HETEROGENOUS ADAPTIVELY PRODUCED PHOTONIC INTERFACES (HAPPI) PROGRAM AIMS TO CREATE A 1000X INCREASE IN THE INFORMATION TRANSMISSION DENSITY WITHIN A MICROSYSTEM BY EXPLOITING PHOTONIC SIGNALING. View parent award on USAspending | — | $1,137,250 | Mar 12, 2025 | — – — |
| Subcontractor | Department of Defense | SEMICONDUCTOR AND RELATED DEVICE MANUFACTURING 5300116680 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: MD Parent award description: FAST EVENT-BASED NEUROMORPHIC CAMERA AND ELECTRONICS (FENCE) AIMS TO DEVELOP AND DEMONSTRATE A LOW LATENCY, LOW POWER, EVENT-BASED CAMERA AND A NEW CLASS OF SIGNAL PROCESSING AND LEARNING ALGORITHMS THAT ENABLE INTELLIGENT SENSORS. View parent award on USAspending | — | $335,800 | Oct 2, 2024 | — – — |
| Subcontractor | Department of Defense | WAFER FABRICATION AND WAFER-TO-WAFER ASSEMBLY 242986-JG Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: HRL LARGE-FORMAT, SMALL-PITCH FPA FABRICATION FOR MUST-HITS View parent award on USAspending | — | $136,760 | Jul 31, 2024 | — – — |
| Subcontractor | Department of Defense | WAFER FABRICATION 242964-DS Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: HRL LARGE-FORMAT, SMALL-PITCH FPA FABRICATION FOR MUST-HITS View parent award on USAspending | — | $68,075 | Jul 22, 2024 | — – — |
| Subcontractor | Department of Defense | SERVICE ITEM 4106204000 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: WA Parent award description: MELT SEEKS TO DEVELOP A LASER TILE AS THE BUILDING BLOCK FOR COMPACT, SCALABLE, PANELIZED HIGH ENERGY LASER (HEL) SOURCES. View parent award on USAspending | — | $131,503 | Jul 3, 2024 | — – — |
| Subcontractor | Department of Defense | PH18MPD WAFER BUMP 4106282781 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: WA Parent award description: MELT SEEKS TO DEVELOP A LASER TILE AS THE BUILDING BLOCK FOR COMPACT, SCALABLE, PANELIZED HIGH ENERGY LASER (HEL) SOURCES. View parent award on USAspending | — | $52,500 | May 3, 2024 | — – — |
| Subcontractor | Department of Defense | FO SPLITTER/COUPLER. 4202918636 Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: MA Parent award description: HI2PERF View parent award on USAspending | — | $249,830 | Mar 25, 2024 | — – — |
| Subcontractor | Department of Defense | SERVICE ITEM 4106204000 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: WA Parent award description: MELT SEEKS TO DEVELOP A LASER TILE AS THE BUILDING BLOCK FOR COMPACT, SCALABLE, PANELIZED HIGH ENERGY LASER (HEL) SOURCES. View parent award on USAspending | — | $641,478 | Mar 19, 2024 | — – — |
| Subcontractor | Department of Defense | FABRICATION AND ASSEMBLY SERVICES OF 6UM PITCH WAFERS 240947-DS Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: HRL LARGE-FORMAT, SMALL-PITCH FPA FABRICATION FOR MUST-HITS View parent award on USAspending | — | $148,500 | Mar 11, 2024 | — – — |
| Subcontractor | Department of Defense | DROIC SURFACE PREPARATION LOT SPLIT FOR 3D ASSEMBLY SERVICE SURFACE PREPARATION (A-ROIC) WAFER-TO-WAFER ASSEMBLY & BACKSIDE PROC 4106105355 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541712 Parent award performance state: FL Parent award description: IGF::OT::IGF THE RECONFIGURABLE IMAGING (REIMAGINE) PROGRAM AIMS TO DEMONSTRATE MULTI-FUNCTIONAL IMAGING SENSORS THAT ARE RECONFIGURABLE THROUGH SOFTWARE. View parent award on USAspending | — | $227,125 | Dec 4, 2023 | — – — |
| Subcontractor | Department of Defense | HUMAN RESOURCES SERV 5300065951 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: MD Parent award description: THE GOAL OF MINITHERMS3D IS TO REVOLUTIONIZE THERMAL MANAGEMENT FOR THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION(3DHI)AND SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK WHILE INCREASING VOLUMETRIC HEAT REMOVAL. View parent award on USAspending | — | $130,000 | Nov 21, 2023 | — – — |
| Subcontractor | Department of Defense | TECH/ENG SERVICES. 4202674778 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: MA Parent award description: ELECTRONICS FOR G-BAND ARRAYS (ELGAR) PHASE 1 View parent award on USAspending | — | $704,876 | Oct 12, 2022 | — – — |
| Subcontractor | Department of Defense | TECH/ENG SERVICES. 4202674778 Parent award context Parent award agency: Department of Defense · Defense Advanced Research Projects Agency Parent award NAICS: 541715 Parent award performance state: MA Parent award description: ELECTRONICS FOR G-BAND ARRAYS (ELGAR) PHASE 1 View parent award on USAspending | — | $704,876 | Sep 19, 2022 | — – — |
| Subcontractor | Department of Defense | WAFERS, PREP AND ASSEMBLY 212967-GF CN 1 Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: WAFER-SCALE INTEGRATION OF III-V DETECTORS FOR SMALL PITCH, LARGE FORMAT FPAS View parent award on USAspending | — | $124,650 | Jan 19, 2022 | — – — |
| Subcontractor | Department of Defense | WAFER LOT WITH NO BACKSIDE PROCESSING 212967-GF Parent award context Parent award agency: Department of Defense · Department of the Navy Parent award NAICS: 541715 Parent award performance state: CA Parent award description: WAFER-SCALE INTEGRATION OF III-V DETECTORS FOR SMALL PITCH, LARGE FORMAT FPAS View parent award on USAspending | — | $33,000 | Oct 6, 2021 | — – — |
| Subcontractor | Department of Energy | 600617_NHANCED SEMICONDUCTORS INC - PO 600617 AGREEMENT FOR RESEARCH AND DEVELOPMENT 600617 Parent award context Parent award agency: Department of Energy · Department of Energy Parent award NAICS: 561210 Parent award performance state: NM Parent award description: IGF::CL::IGF COMPETITION FOR MANAGEMENT AND OPERATION OF LOS ALAMOS NATIONAL LABORATORY View parent award on USAspending | — | $1,191,340 | Oct 6, 2021 | — – — |
Contract vehicles are shown only when present in the source record. Linked award numbers and vehicles open the authoritative record on USAspending.gov.
Government-sourced data comes from SAM.gov, SBA and USAspending.gov and is attributed to its source. Items marked company-reported were provided by the company and are verified by FedSub only where labeled. FedSub is a private company and is not affiliated with SBA, GSA/SAM.gov, or any government agency.